04799128 is referenced by 70 patents and cites 18 patents.

A multilayer printed circuit board included a plurality of substrates bonded together in which the surface area of each substrate is divided into equal surface areas in which each area may contain the same number and lengths of lines of conductive elements, monitor holes, plated-through holes and circuit components. Connecting pads mounted within each substrate and intersected by a plated-through hole are positioned adjacent the conductive elements within the substrate and are connected to the elements by connecting segments. The circuit components mounted on a surface of the circuit board have their lead elements connected by bridge members to a monitor hole for testing purposes, said bridge member being severable to isolate the circuit components. A method for manufacturing such a multilayer printed circuit board is likewise disclosed.

Title
Multilayer printed circuit board with domain partitioning
Application Number
811188
Publication Number
4799128
Application Date
April 10, 1987
Publication Date
January 17, 1989
Inventor
Paul T H Chen
St. Paul
MN, US
Agent
Jack R Penrod
Edward Dugas
Wilbert Hawk Jr
Assignee
NCR Corporation
OH, US
IPC
H05K 1/16
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