04783695 is referenced by 332 patents and cites 18 patents.

A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnection metallization which serves to connect various chips and chip pads within the interconnection pads disposed on the chips. A significant advantage of the packaging method and configuration of the present invention is the ability for the polymer film to be removed. This significantly improves testability and effectively provides wafer scale integration circuit packages which are free of problems associated with yield and testability.

Title
Multichip integrated circuit packaging configuration and method
Application Number
6/912456
Publication Number
4783695
Application Date
September 26, 1986
Publication Date
November 8, 1988
Inventor
Robert J Wojnarowski
Ballston Lake
NY, US
Charles W Eichelberger
Schenectady
NY, US
Agent
James C Davis Jr
Marvin Snyder
Assignee
General Electric Company
NY, US
IPC
H01L 23/48
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