An integrated circuit handler provides very high throughput rates and very low manual labor requirements. A sleeve handler portion provides nearly all of the sleeve handling needs of the handler, receiving periodic inputs of a plurality of sleeves, orienting and unloading the sleeves, reloading the sleeves and binning the sleeves according to output category. Once out of the sleeves, the integrated circuits are handled, in turn, by an input buffer, a transport mechanism which presents the integrated circuits to a workstation, a sort mechanism and an output buffer/sleeve loader mechanism. The particular embodiment disclosed in detail comprises a handler optimized for handling SOIC devices. No gravity-driven mechanisms are used in the handler. Throughput rates up to 60,000 parts per hour and more are possible.