04764846 is referenced by 205 patents and cites 8 patents.

A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity, inside which one or more IC chips are located. Each cavity-providing sub-module may be formed either by securing a rectangular frame to a chip-carrying substrate, or by etching a cavity in a single piece of material. In the latter case, the chips are mounted on the flat surface of one sub-module, and located inside the cavity of the next sub-module.

Title
High density electronic package comprising stacked sub-modules
Application Number
7/562
Publication Number
4764846
Application Date
January 5, 1987
Publication Date
August 16, 1988
Inventor
Tiong C Go
El Toro
CA, US
Agent
Thomas J Plante
Assignee
Irvine Sensors Corporation
CA, US
IPC
H05K 7/00
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