04764723 is referenced by 83 patents and cites 4 patents.

A wafer probe for testing semiconductor devices brings low impedance connections closely adjacent device bonding pads for bypassing power supply voltages.

Title
Wafer probe
Application Number
6/928987
Publication Number
4764723
Application Date
November 10, 1986
Publication Date
August 16, 1988
Inventor
Eric W Strid
Portland
OR, US
Agent
Dellett Smith Hill and Bedell
Assignee
Cascade Microtech
OR, US
IPC
H01P 3/08
G01R 1/06
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