04744008 is referenced by 43 patents and cites 34 patents.

An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier includes at least one semiconductor chip mounted on one major surface thereof and at least one decoupling capacitor mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package.

Title
Flexible film chip carrier with decoupling capacitors
Application Number
931813
Publication Number
4744008
Application Date
September 11, 1987
Publication Date
May 10, 1988
Inventor
Leonard T Olson
Endwell
NY, US
Ronald S Charsky
Binghamton
NY, US
Vincent J Black
Apalachin
NY, US
Agent
H Saint Julian
David L Adour
Assignee
International Business Machines Corporation
NY, US
IPC
H05K 7/20
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