04739448 is referenced by 120 patents and cites 14 patents.

A multilayered integrated circuit chip carrier has a top layer, a signal line layer, a ground layer, a power conductor layer, and a bottom layer with a separating layer between adjacent layers. Each layer has coplanar conductive and dielectric portions, the separating layers being primarily dielectric. The top layer supports an integrated circuit chip and signal launcher pads on the bottom layer couple signal and power lines of a printed circuit board to spaced points about the bottom layer periphery and substantially constant signal line impedance is achieved. The signal line layer is separated from the power conductor layer by a ground plane layer. Conductive via through pads are placed in the separating layers to form a plurality of separate conductive paths from each of the bottom and top layers to each of the signal line and power conductor layers. Via through pads are also placed in the separating layers to break up cavities and thus increase cavity resonance above signal frequencies and are placed in the signal line layer to provide signal line isolation. Thermal columns of via pads in the separating layers and conductive portions in the other layers under the chip provide chip cooling. Large grounded conductive areas in the top and bottom layers reduce unwanted signal coupling to the external environment. A capacitive coupling on the top layer between a power conductor and ground provides power line isolation.

Title
Microwave multiport multilayered integrated circuit chip carrier
Application Number
6/623990
Publication Number
4739448
Application Date
June 25, 1984
Publication Date
April 19, 1988
Inventor
Robert E Dietterle
Fullerton
CA, US
Binneg Y Lao
Rancho Palos Verdes
CA, US
David A Rowe
Redondo Beach
CA, US
Agent
Richard T Seeger
William J Streeter
Thomas A Briody
Assignee
Magnavox Government and Industrial Electronics Company
IN, US
IPC
H05K 7/20
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