An improved test probe card for testing unpackaged integrated-circuit (IC) chips prior to installation of the chips in some type of electronic device. The test probe card includes a chip insulating board having openings at positions corresponding to contact areas of an IC chip and a test circuit board having inner contact areas at positions corresponding to the openings in the chip insulating board. Electrical connections between the IC chip and inner circuit board contact areas are established with conductive connector elements positioned in the openings. Circuit board traces electrically connect the inner circuit board contact areas with outer contact areas located about the periphery of the circuit board. The outer contact areas are preferably connected to a testing device using coaxial cables, which are electrically connected to the outer contact areas with a coaxial cable connecting board. The connector elements are preferably each formed from a single strand of metal wire, each strand being wadded together to form a nearly cylindrical "button" of material.