04729061 is referenced by 151 patents and cites 7 patents.

The invention discloses an improved PC board package for at least one integrated circuit die utilizing a plurality of PC boards bonded together to form a composite. The composite has at least one cavity, for mounting of an integrated circuit die, formed in at least one PC board of the composite. The cavity walls are plated to seal off portions of the PC board exposed by formation of the cavity to thereby prevent subsequent outgassing. Heat tubes are formed in a PC board adjacent the PC board with the cavity to conduct heat from an integrated circuit chip mounted in the cavity to an opposite surface of the package.

Title
Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
Application Number
728053
Publication Number
4729061
Application Date
May 23, 1986
Publication Date
March 1, 1988
Inventor
Candice H Brown
San Jose
CA, US
Agent
Eugene H Valet
John P Taylor
Patrick T King
Assignee
Advanced Micro Devices
CA, US
IPC
H05K 7/20
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