04710419 is referenced by 37 patents and cites 5 patents.

A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step.

Title
In-mold process for fabrication of molded plastic printed circuit boards
Application Number
631209
Publication Number
4710419
Application Date
March 21, 1986
Publication Date
December 1, 1987
Inventor
Vernon C Gregory
239 W. Myrna La., Tempe, 85284
AZ, US
Agent
Ostrolenk Faber Gerb & Soffen
IPC
B44C 1/22
G03C 5/00
H05K 1/00
B32B 3/00
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