04705917 is referenced by 69 patents and cites 7 patents.

A microelectronic package for the protection, housing, cooling and interconnection of a microelectronic chip. The package is made of a plurality of ceramic layers, each of which carries a particular electrically conductive pattern and which have interior openings therein so as to provide recesses in which the chip and discrete capacitors can be located and connected.

Title
Microelectronic package
Application Number
6/770038
Publication Number
4705917
Application Date
August 27, 1985
Publication Date
November 10, 1987
Inventor
Don C Devendorf
Los Angeles
CA, US
Albert Kamensky
Redondo Beach
CA, US
Louis E Gates Jr
Westlake Village
CA, US
Agent
A W Karambelas
L A Alkov
Assignee
Hughes Aircraft Company
CA, US
IPC
H01L 23/02
View Original Source