04679118 is referenced by 112 patents and cites 5 patents.

Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.

Title
Electronic chip-carrier heat sinks
Application Number
638415
Publication Number
4679118
Application Date
July 28, 1986
Publication Date
July 7, 1987
Inventor
Alfred F McCarthy
Belmount
NH, US
Philip A Johnson
Exeter
NH, US
Agent
James E Mrose
Assignee
Aavid Engineering
NH, US
IPC
H05K 7/20
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