04677528 is referenced by 117 patents and cites 20 patents.

A flexible printed circuit board assembly having an integrated circuit die bonded directly thereto. A first layer of the flexible printed circuit board assembly includes a plurality of conductive paths and geometrical patterns on each of its surfaces. The conductive patterns include pads for mounting the integrated circuit die and connecting the wires from the integrated circuit. Additional intermediate layers of the flexible printed circuit board assembly, having an aggregate thickness greater than the height of the integrated circuit die and associated leads bonded thereto, surround the integrated circuit die. The top layer of the flexible printed circuit board provides for total encapsulation of the integrated circuit die for protection thereof. In the preferred embodiment that portion of the top layer which covers the integrated circuit die is opaque to prevent the passage of ultraviolet light which might otherwise cause damage to the integrated circuit.

Title
Flexible printed circuit board having integrated circuit die or the like affixed thereto
Application Number
615844
Publication Number
4677528
Application Date
January 27, 1986
Publication Date
June 30, 1987
Inventor
Jay J Miniet
Ft. Lauderdale
FL, US
Agent
Joseph T Downey
Daniel K Nichols
Martin J McKinley
Assignee
Motorola
IL, US
IPC
H05K 1/18
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