A digital logic bus termination module that is to be plugged into a TTL logic backplane bus and in which the module includes a TTL logic circuit chip package having multiple terminals including a reference terminal, input terminal and output terminal. The TTL logic circuit chip package comprises an input diode, preferably a Schottky diode connected to the input terminal thereof and forming a bus termination clamping means. The bus line is connected to the input terminal of the chip package while the bus reference line is coupled to the reference or ground terminal for the circuit chip package. The TTL logic circuit chip package has the output terminal thereof unconnected so that only the diode is in operative association with the bus. One or more resistors may also be used in parallel with the clamping diodes for impedance matching purposes.