04672152 is referenced by 52 patents and cites 11 patents.

A ceramic insulating layer (2) for the multilayer ceramic circuit board (11) consists of 60 wt % of crystallized glass and 40 wt % of a filler such as silicon dioxide bonded by the crystallized glass, which consists of 6-15 wt % of lithium oxide, 70-90 wt % of silicon dioxide, 1-8 wt % of aluminum oxide, 1-5 wt % of alkaline metal oxide other than lithium oxide and 2-5 wt % of alkaline earth metal oxide. The sintered ceramic insulating layer (2) has a dielectric constant below 6.1 and a flexural strength above 150 MPa and is co-firable with a wiring conductor layer of such as gold, silver and copper.

Title
Multilayer ceramic circuit board
Application Number
6/888410
Publication Number
4672152
Application Date
July 23, 1986
Publication Date
June 9, 1987
Inventor
Satoru Ogihara
Hitachi
JP
Kousei Nagayama
Toukai
JP
Nobuyuki Ushifusa
Hitachi
JP
Hiroichi Shinohara
Hitachi
JP
Agent
Antonelli Terry & Wands
Assignee
Hitachi
JP
IPC
H05K 1/03
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