04646128 is referenced by 150 patents and cites 4 patents.

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

Title
High-density electronic processing package--structure and fabrication
Application Number
187787
Publication Number
4646128
Application Date
April 8, 1985
Publication Date
February 24, 1987
Inventor
Stewart A Clark
Irvine
CA, US
John C Carson
Corona del Mar
CA, US
Agent
Thomas J Plante
Assignee
Irvine Sensors Corporation
CA, US
IPC
H01L 23/48
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