04631572 is referenced by 7 patents and cites 7 patents.

An integrated circuit package has a conductive ring surrounding the integrated circuit substrate and optionally, over the integrated circuit itself, and wires connected between selected chip pads and adjacent portions of the surrounding ring, the surrounding ring being connected to only one of a plurality of external conductive pins of the chip package, the remainder of the external pins being connected to other selected chip pads.

Title
Multiple path signal distribution to large scale integration chips
Application Number
6/536129
Publication Number
4631572
Application Date
September 27, 1983
Publication Date
December 23, 1986
Inventor
Thomas A Zimmerman
Rancho Palos Verdes
CA, US
Agent
Robert J Stern
Donald R Nyhagen
Noel F Heal
Assignee
TRW
CA, US
IPC
H01L 39/02
H01L 23/16
H01L 23/02
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