04630096 is referenced by 79 patents and cites 19 patents.

An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, and the substrate have a smooth upper surface adapted to receive monolithic interconnections formed by planar metallization methods. The resulting assembly is enclosed in a housing also formed substantially from silicon, which contains electrically isolated pins for contacting the input-output electrodes of the assembly. Preferential etching is used to form the through-holes in the substrate as well as various alignment means on the substrate and other parts of the housing so that they are self-aligning during assembly. Improved performance, reliability, and low cost is obtained.

Title
High density IC module assembly
Application Number
6/615499
Publication Number
4630096
Application Date
May 30, 1984
Publication Date
December 16, 1986
Inventor
Vern H Winchell II
Scottsdale
AZ, US
Jack A Schroeder
Austin
TX, US
James E Drye
Mesa
AZ, US
Agent
Robert M Handy
Assignee
Motorola
IL, US
IPC
H01L 23/40
H01L 23/18
H01L 23/12
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