04597617 is referenced by 99 patents and cites 8 patents.

A pressure interconnect package for connecting an integrated circuit chip to an etched circuit board comprising a pressurized stack of circuit elements in which a flexible interconnecting circuit is disposed between the IC chip and the etched circuit board to cause them to make electrical contact upon the application of pressure to the stack.

Title
Pressure interconnect package for integrated circuits
Application Number
6/591348
Publication Number
4597617
Application Date
March 19, 1984
Publication Date
July 1, 1986
Inventor
Raymond S Enochs
Hillsboro
OR, US
Agent
William O Geny
John Smith Hill
John D Winkelman
Assignee
Tektronix
OR, US
IPC
H01R 23/72
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