04587596 is referenced by 102 patents and cites 8 patents.

A high density mother/daughter circuit board connector utilizes a multi-layer flat flexible circuit, each layer of which contains a plurality of patterned arrays of circuit paths extending between spaced contact points, at least some of which are exposed through apertures in overlying layers. The multi-layered circuitry is wrapped around a housing from a mother circuit board face to extend into one side of a daughter board receiving recess. Camming means arranged in the opposite side of the recess drive a daughter circuit board inserted therein transversely of the recess into loaded engagement with the multi-layer circuitry thereby establishing electrical interconnection between the circuitry of the mother and daughter circuit boards.

Title
High density mother/daughter circuit board connector
Application Number
6/597982
Publication Number
4587596
Application Date
April 9, 1984
Publication Date
May 6, 1986
Inventor
Edward D Bunnell
Palm Harbor
FL, US
Agent
Robert W Pitts
Russell J Egan
Assignee
AMP Incorporated
PA, US
IPC
H05K 1/18
View Original Source