04584767 is referenced by 44 patents and cites 10 patents.

A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step.

Title
In-mold process for fabrication of molded plastic printed circuit boards
Application Number
6/631209
Publication Number
4584767
Application Date
July 16, 1984
Publication Date
April 29, 1986
Inventor
Vernon C Gregory
239 W. Myrna La., Tempe, 85284
AZ, US
Agent
Ostrolenk Faber Gerb & Soffen
IPC
H01K 3/22
View Original Source