04581679 is referenced by 94 patents and cites 5 patents.

A packaging construction for electronic circuit package elements, such as printed circuit boards and integrated-circuit chip packages, to obviate the need for connector cables, back-panel wiring and similar techniques. Circuit packaging elements are interconnected through an interconnection medium that includes an insulated board with opening through it, and a number of connector elements in the form of compressible wads of conductive wire. The connector elements are disposed in selected openings in the insulated board and compressed into contact with contact areas formed on the circuit package elements. Shorter lead lengths and improved circuit operating speed are the principal results of the approach. In a three-dimensional construction employing the principles of the invention, chip packages are arranged in modules, and interconnections may be made between chip packages within each module, tranversely between modules, and in a third direction between layers of modules. The construction provides direct interconnections without the use of solder, connector cables or multilayer circuit boards, and makes most effective use of high-speed integrated circuitry.

Title
Multi-element circuit construction
Application Number
499136
Publication Number
4581679
Application Date
May 24, 1985
Publication Date
April 8, 1986
Inventor
Robert Smolley
Porteughese Bend
CA, US
Agent
Robert M Wallace
Noel F Heal
Assignee
TRW
CA, US
IPC
H05K 1/14
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