04558117 is referenced by 17 patents and cites 3 patents.

An organic solvent-soluble photosensitive polyimide resin having excellent heat resistance and electrical and mechanical properties, comprising a copolycondensation product of a biphenyltetracarboxylic acid component with an aromatic diamine component consisting of 40 to 90 molar % of a diamine compound of the formula (I) and 10 to 60 molar % of a diaminodiphenylether compound of the formula (II), ##STR1## wherein X=--CO--O-- or --CH.sub.2 --O--, R.sub.1 and R.sub.2 =an organic residue having an ethylenically unsaturated radical, and R.sub.3 =H or --NHCOR.sub.2.

Title
Organic solvent-soluble photosensitive polyimide resin
Application Number
6/615309
Publication Number
4558117
Application Date
May 30, 1984
Publication Date
December 10, 1985
Inventor
Kazuaki Nishio
Ichihara
JP
Hiroshi Yasuno
Ichihara
JP
Tsunetomo Nakano
Ichihara
JP
Agent
Burgess Ryan & Wayne
Assignee
UBE
JP
IPC
C08G 73/12
C08G 73/10
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