04555532 is referenced by 10 patents and cites 6 patents.

An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.

Title
Epoxy resin composition
Application Number
6/659565
Publication Number
4555532
Application Date
October 10, 1984
Publication Date
November 26, 1985
Inventor
Hitoshi Oka
Yokohama
JP
Akira Tomizawa
Yokohama
JP
Hiroshi Kikuchi
Zushi
JP
Isamu Tanaka
Yokosuka
JP
Agent
Antonelli Terry & Wands
Assignee
Hitachi
JP
IPC
C09D 3/58
C08L 63/00
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