04554033 is referenced by 49 patents and cites 11 patents.

An interconnecting means is comprised of one or more conductive ink conductors printed onto a first substrate, the conductive ink being comprised of an insulating polymer medium having first and second groups of conductive particles therein, and an insulating layer of flowable adhesive in covering relationship to the conductors. The first group of particles are finely divided particles which are suspended in the medium and form a continuous conductive path along the length of the conductor. The second group of particles are agglomerates of large particles which are randomly scattered throughout the conductive path and project above the surface of the medium. Interconnection is effected by positioning the first substrate conductors in an overlapping conducting relationship to the conductors on the second substrate such that the flowable adhesive is deposited between the two substrates and applying pressure to the positioned conductors and surrounding areas. The adhesive flows from the positioned areas, exposes the protruding agglomerates, thus bringing the agglomerates into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

Title
Method of forming an electrical interconnection means
Application Number
6/657851
Publication Number
4554033
Application Date
October 4, 1984
Publication Date
November 19, 1985
Inventor
Warren C Jones
Winston-Salem
NC, US
Ronald A Dery
Winston-Salem
NC, US
Agent
Katherine A Nelson
Assignee
AMP Incorporated
PA, US
IPC
H01B 13/06
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