04545610 is referenced by 260 patents and cites 12 patents.

A process for forming elongated solder terminals to connect a plurality of pads on a semiconductor device to a corresponding plurality of pads on a supporting substrate by,

Title
Method for forming elongated solder connections between a semiconductor device and a supporting substrate
Application Number
6/555264
Publication Number
4545610
Application Date
November 25, 1983
Publication Date
October 8, 1985
Inventor
Peter J Tubiola
Wappingers Falls
NY, US
Jose Ordonez
Pleasant Valley
NY, US
Mark N Lakritz
Wappingers Falls
NY, US
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/44
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