04533787 is referenced by 34 patents and cites 5 patents.

Certain regions of a printed circuit assembly having mechanically laid wires are formed of two parallel sheets of polyimide film, the circuit assembly being flexible in those regions. The edges of these sheets of film are secured in the region of the edges of the rigid parts of the assembly by means of thermally activated adhesives. In the flexible regions, the wires are embedded in a thermally activated adhesive layer held between the two sheets of polyimide film. This adhesive layer, unlike adhesive layers on the rigid parts, contains no fabric.

Title
Printed circuit assembly
Application Number
6/440999
Publication Number
4533787
Application Date
November 12, 1982
Publication Date
August 6, 1985
Inventor
Heinz Dappen
Flumenthal
CH
Josef Furrer
Luterbach
CH
Fredy Anderegg
Lohn
CH
Agent
Oblon Fisher Spivak McClelland & Maier
Assignee
Autophon
CH
IPC
H05K 1/03
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