04525921 is referenced by 202 patents and cites 1 patents.

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

Title
High-density electronic processing package-structure and fabrication
Application Number
187787
Publication Number
4525921
Application Date
July 25, 1983
Publication Date
July 2, 1985
Inventor
Stewart A Clark
Irvine
CA, US
John C Carson
Corona del Mar
CA, US
Agent
Thomas J Plante
Assignee
Irvine Sensors Corporation
CA, US
IPC
H01L 21/92
H01L 21/90
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