The high pressure/high temperature (HP/HT) process for making diamond or CBN compacts has been modified by placing partitions within the crystal mass before HP/HT processing. With reference to FIG. 3, within the shield metal sleeve 11 and shield metal cup 14 are placed pliable metal shapes 20 in a honeycomb pattern. The abrasive crystals within the tubes 18 and outside the tubes 26 is sintered, and a compact containing the tubes embedded therein results. This compact can be acid leached to give a plurality of small compacts which need little if any additional shaping. The partitions can also be left intact as chip arresters.