04493606 is referenced by 29 patents and cites 12 patents.

Apparatus for placing a first element at a receptacle location on a second element, there being associated with the precise receptacle location some known variation in the shape of the second element, the apparatus comprising a support member for supporting the first element while the member is translated toward the second element along a placement direction, a first transport device for moving the support member or the second element along a direction transverse to the placement direction, and a sensing device located on the support member for sensing the relative alignment along the transverse direction of the support member and the variation in shape, the sensing device comprising an energy-beam source adapted and positioned to direct an energy beam along a path that interacts with the variation in shape at least when the support member and receptacle location are aligned so that more of the beam is transmitted along the path when the member and receptacle location are aligned than when the member and receptacle are not aligned and an energy beam sensor adapted and positioned to detect the difference in the amount of the beam transmitted along the path.

Title
Wafer transfer apparatus
Application Number
6/381292
Publication Number
4493606
Application Date
May 24, 1982
Publication Date
January 15, 1985
Inventor
Steven M Lord
Malden
MA, US
Richard F Foulke
Carlisle
MA, US
Assignee
Proconics International
MA, US
IPC
B65G 17/32
View Original Source