04423435 is referenced by 27 patents and cites 4 patents.

An electronic device, such as an integrated circuit formed on a single semiconductor chip, is mounted on a relatively flat insulative substrate, such as a chip carrier or printed circuit board, and electrically connected to electrical conductors on the substrate by means of a bonding material disposed between the device and substrate. The device is placed on the substrate with its electrically active surface in facing relationship with the substrate and with its electrical contact pads in registration with selected ones of the substrate conductors. The bonding material is substantially electrically conductive only along one axis which is orthogonal to the major planes of the device and substrate to provide an electrically conductive path between the contact pads and electrical conductors. The bonding material is allowed to accumulate along the perimeter of the electronic device to form a protective seal between the electronic device and the substrate.

Title
Assembly of an electronic device on an insulative substrate
Application Number
6/200740
Publication Number
4423435
Application Date
October 27, 1980
Publication Date
December 27, 1983
Inventor
Howard R Test II
Lubbock
TX, US
Agent
Melvin Sharp
Leo N Heiting
Robert D Marshall Jr
Assignee
Texas Instruments Incorporated
TX, US
IPC
H01L 23/48
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