04420767 is referenced by 94 patents and cites 1 patents.

A thermally balanced leadless microelectronic circuit chip carrier in which the chip is mounted directly on a heat sinking member by means of a conductive stress relieving polyimide. The heat sinking member, which has a support surface for the chip and an extending threaded shaft, is held by a carrier member thermally compatible with the surface on which the package is to be used. The shaft passes through the carrier member and receiving surface to a heat sinking nut which holds the package to the receiving surface. Leads on the carrier member surface are used to connect the receiving surface to the wires bonded to the chip contacts.

Title
Thermally balanced leadless microelectronic circuit chip carrier
Application Number
959345
Publication Number
4420767
Application Date
August 22, 1980
Publication Date
December 13, 1983
Inventor
Mark A Brodsky
Sunnyvale
CA, US
Robin H Hodge
Menlo Park
CA, US
Agent
Majestic Gallagher Parsons & Siebert
Assignee
Zilog
CA, US
IPC
H01L 23/02
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