04417266 is referenced by 171 patents and cites 2 patents.

A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected in a bus structure around the chip at the center of the chip carrier with the chip being secured to the chip carrier with the bus structure over a thermal pad formed within the bus structure. A decoupling capacitor is located in close proximity to the chip on the substrate to assure low reaction due to switching.

Title
Power and ground plane structure for chip carrier
Application Number
6/293052
Publication Number
4417266
Application Date
August 14, 1981
Publication Date
November 22, 1983
Inventor
Dimitry G Grabbe
Lisbon Falls
ME, US
Agent
Donald M Boles
Assignee
AMP Incorporated
PA, US
IPC
H01L 29/44
H01L 23/48
H01L 39/02
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