04390598 is referenced by 27 patents and cites 6 patents.

A lead frame (20) for tape automated bonding includes individual leads (12) each having a stretch loop (40) to accommodate elongation of the loop as the lead is bonded to a substrate (28) after inner lead bonds have been formed to an integrated circuit (26). Such a lead frame allows temporary connection and testing of the circuit prior to final lead formation and packaging.

Title
Lead format for tape automated bonding
Application Number
6/365686
Publication Number
4390598
Application Date
April 5, 1982
Publication Date
June 28, 1983
Inventor
William S Phy
Los Altos Hills
CA, US
Agent
Theodore Scott Park
Michael J Pollock
Kenneth Olsen
Assignee
Fairchild Camera & Instrument
CA, US
IPC
H01L 23/48
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