04370292 is referenced by 34 patents and cites 9 patents.

An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process.

Title
Encapsulation of electronic device
Application Number
6/270233
Publication Number
4370292
Application Date
June 4, 1981
Publication Date
January 25, 1983
Inventor
Takeshi Abe
Yokohama
JP
Fukuo Kanno
Yokohama
JP
Hiroshi Yanase
Yokohama
JP
Agent
Oblon Fisher Spivak McClelland & Maier
Assignee
Asahi Glass Company
JP
IPC
B29C 6/00
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