04347286 is referenced by 10 patents and cites 6 patents.

A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR1## with an aromatic diamine into imide, provided on at least one surface of the polyimide film, and a process for producing the film.

Title
Heat fusible polyimide compound films and process for producing the same
Application Number
6/238283
Publication Number
4347286
Application Date
February 25, 1981
Publication Date
August 31, 1982
Inventor
Masao Nakamura
Ibaraki
JP
Yasuhiro Moriyama
Ibaraki
JP
Takashi Ishizuka
Ibaraki
JP
Agent
Sughrue Mion Zinn Macpeak & Seas
Assignee
Nitto Electric Industrial
JP
IPC
C09J 7/02
B32B 27/28
B32B 27/08
B05D 5/12
B05D 5/10
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