04336114 is referenced by 63 patents and cites 5 patents.

A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating electrolyte particularly suited for plating electronic circuit boards containing a brightening and leveling amount of a brightening and leveling system comprising (a) a bath soluble substituted phthalocyanine radical, (b) a bath soluble adduct of a tertiary alkyl amine with polyepichlorohydrin, (c) a bath soluble organic divalent sulfur compound, and (d) a bath soluble reaction product of polyethyleneimine and an alkylating agent which will alkylate the nitrogen on the polyethyleneimine to produce a quaternary nitrogen. The electrolyte optionally also contains bath soluble polyether compounds as a supplemental brightening agent.

Title
Electrodeposition of bright copper
Application Number
6/247577
Publication Number
4336114
Application Date
March 26, 1981
Publication Date
June 22, 1982
Inventor
Stephen C Barbieri
Rutherford
NJ, US
Linda J Mayer
Denville
NJ, US
Agent
Arthur E Kluegel
Richard P Mueller
Assignee
Hooker Chemicals & Plastics
MI, US
IPC
C25D 3/38
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