04316074 is referenced by 47 patents and cites 17 patents.

A laser system is disclosed for facilitating transient surface heating and/or melting and regrowth of amorphous, polycrystalline or imperfect crystalline semiconductor wafer material. This system also has specific application to gettering of impurities and the annealing-out of defects within a semiconductor wafer. In the system, a number of circular target-wafers are arranged around the periphery of a turntable. The turntable rotates while a simple, slow-moving beam-delivery system moves radially with respect to the turntable delivering a helical scan which may also be in the form of a multiple-track. Use of the turntable with a multiple wafer load allows efficient batch-processing. Blocking masks may be employed when it is desired to irradiate only selected areas of the semiconductor substrates.

Title
Method and apparatus for laser irradiating semiconductor material
Application Number
5/971515
Publication Number
4316074
Application Date
December 20, 1978
Publication Date
February 16, 1982
Inventor
Richard T Daly
Huntington
NY, US
Agent
Kane Dalsimer Kane Sullivan & Kurucz
Assignee
Quantronix Corporation
NY, US
IPC
B23K 27/00
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