04295596 is referenced by 95 patents and cites 5 patents.

A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.

Title
Methods and apparatus for bonding an article to a metallized substrate
Application Number
6/105463
Publication Number
4295596
Application Date
December 19, 1979
Publication Date
October 20, 1981
Inventor
John J Svitak
Lower Makefield Township, Bucks County
PA, US
Bradford O Doten
Hopewell Township, Mercer County
NJ, US
Agent
D J Kirk
Assignee
Western Electric Company
NY, US
IPC
H01S 21/60
B23K 1/12
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