An improved integrated circuit ceramic package meeting JEDEC-11 standards and having a nominal pin (lead) count of from 24 to 156. Control measures and assembly procedures referenced to the precise center of the die-attach area provide closer dimensional control and lead coplanarity which facilitate automatic die-attach and wire-bonding operations. A lead frame is provided with both diagonal and axial (X-Y) registration points, and internal and external lead tie-bars. It is precisely attached in special tools to a ceramic cover element, and the internal tie bars are sheared off. The cover sub-assembly is then secured to a ceramic base in similar tools. Devitrification of the sealing glass follows. The external tie bars form a convenient carrier protecting the leads, and the registration points provide precise siting for die-attach and wire bonding.