04288841 is referenced by 233 patents and cites 10 patents.

A semiconductor device including a double cavity semiconductor chip carrier 100 which comprises a multilayer ceramic sandwich structure having a pair of semiconductor chip receiving cavities in the opposite faces thereof. The package enables mounting and electrical interconnection of a pair of semiconductor integrated circuit chips in a package of the same size as that for a single chip and having somewhat greater thickness.

External terminals 93 on an outside face of the carrier are connected selectively by metallization paths 44, 53, 55, 83 integral with the carrier to chip mounting pads 41, 51 and to internal terminals 28 within the carrier. The internal terminals are disposed peripherally with respect to the chip cavities and adapted for interconnection with chip contact pads 26. Thus, a pair of unlike semiconductor integrated circuits can be interconnected in accordance with different patterns within a single package.

Title
Double cavity semiconductor chip carrier
Application Number
6/76972
Publication Number
4288841
Application Date
September 20, 1979
Publication Date
September 8, 1981
Inventor
John F Gogal
Lebanon
NJ, US
Agent
H W Lockhart
Assignee
Bell Telephone Laboratories Incorporated
NJ, US
IPC
H01L 25/00
H05K 7/06
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