04243744 is referenced by 7 patents and cites 8 patents.

Microwave curing of photoresist films employed in processing semiconductor wafers provides an alternative to conventional drying techniques. The time of curing may be reduced from about 20 to 25 minutes required for conventional air drying to about 5 minutes employing microwave curing. Further, the photoresist film is the only part of the semiconductor assembly that experiences elevated temperatures. The remainder of the wafer remains near ambient conditions, without experiencing possible deleterious effects as a consequence of the high temperature processing.

Title
Microwave curing of photoresist films
Application Number
5/972259
Publication Number
4243744
Application Date
December 22, 1978
Publication Date
January 6, 1981
Inventor
Thomas F McGee
Harrison
NY, US
Harry F Lockwood
New York
NY, US
Agent
Paul E Purwin
David W Collins
Assignee
Exxon Research & Engineering Co
NJ, US
IPC
G03C 5/00
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