An integrated circuit device package is disclosed wherein a pair of dielectric support structures are provided, each one having a pattern of electrical conductors for interconnecting integrated circuit devices disposed thereon. The electrical conductors have end portions terminating into a plurality of contact pads disposed on a first surface of the support structures. A first one of the pair of support structures has corresponding contact pads on a second, opposite surface of the support structure, each one of the contact pads on the first surface being electrically connected to a corresponding one of the contact pads on the second surface. A dielectric spacer having a plurality of electrical contact pins is disposed between the pair of support structures. One end of each pin is electrically connected to a corresponding one of the contact pads disposed on the second surface of the first one of such structures, and the other end of such contact pin is electrically connected to a corresponding one of the contact pins disposed on the first surface of the second one of the structures. The contact pins are relatively short and thereby provide a relatively short electrical interconnect for the integrated circuit devices, thereby reducing parasitic capacitances normally associated with electrical interconnects.