04225900 is referenced by 85 patents and cites 4 patents.

An integrated circuit device package is disclosed wherein a pair of dielectric support structures are provided, each one having a pattern of electrical conductors for interconnecting integrated circuit devices disposed thereon. The electrical conductors have end portions terminating into a plurality of contact pads disposed on a first surface of the support structures. A first one of the pair of support structures has corresponding contact pads on a second, opposite surface of the support structure, each one of the contact pads on the first surface being electrically connected to a corresponding one of the contact pads on the second surface. A dielectric spacer having a plurality of electrical contact pins is disposed between the pair of support structures. One end of each pin is electrically connected to a corresponding one of the contact pads disposed on the second surface of the first one of such structures, and the other end of such contact pin is electrically connected to a corresponding one of the contact pins disposed on the first surface of the second one of the structures. The contact pins are relatively short and thereby provide a relatively short electrical interconnect for the integrated circuit devices, thereby reducing parasitic capacitances normally associated with electrical interconnects.

Title
Integrated circuit device package interconnect means
Application Number
5/954513
Publication Number
4225900
Application Date
October 25, 1978
Publication Date
September 30, 1980
Inventor
Harry J Fardy
Chelmsford
MA, US
Rudolf E Thun
Carlisle
MA, US
Joseph A Ciccio
Winchester
MA, US
Agent
Joseph D Pannone
Richard M Sharkansky
Assignee
Raytheon Company
MA, US
IPC
H05K 1/08
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