04169976 is referenced by 63 patents and cites 3 patents.

A process for cutting or shaping of a ceramic substrate with laser light, comprising pulsing the laser light and moving the pulsing laser light source with respect to the substrate so that individual light pulses strike different spots along the substrate, defining a path; the laser light may pierce the substrate.

Title
Process for cutting or shaping of a substrate by laser
Application Number
772470
Publication Number
4169976
Application Date
December 19, 1977
Publication Date
October 2, 1979
Inventor
Gian Franco Cirri
Florence
IT
Agent
Ostrolenk Faber Gerb & Soffen
Assignee
Valfivre S p A
IT
IPC
B23K 9/00
View Original Source