An electronic apparatus principally comprising a display unit, a mechanical contact type keyboard unit and several LSI (large-scale integrated circuit) elements including a computation circuit, a logical control circuit, a storage circuit, a program memory circuit, etc., these units and elements all being incorporated on a single flexible plate of electrical insulating material, such as a film of polyethylene-terephthalate or a polyamide. The metal depositing technology or the etching technology is applied to form a wiring pattern on the flexible plate. The LSI elements are directly mounted on the single flexible plate by utilizing the wireless bonding method, such as for example, a flip chip bond or a beam lead bond, before these elements are packed and sealed. The substratum may be secured in the inside of the apparatus in a serpentine fashion in order to make the best use of the inside space of the apparatus. It is easy to adjust the angle or the position of the display units with respect to the keyboard unit, since the display units are mounted on the flexible plate.