03971127 is referenced by 42 patents and cites 7 patents.

A method of fabricating a folded printed wiring board assembly includes the steps of cutting an aperture into a rigid board; bonding a flexible circuit tape to one side of the board so that the tape bridges the aperture; perforating a plurality of holes through the board and flexible tape; inserting leads of electrical components through the holes; conductively bonding the leads to conductors on the flexible circuit tape; cutting two edges of the board through the aperture; and folding the assembly in the area of the aperture.

Title
Method of fabricating a printed wiring board assembly
Application Number
5/611911
Publication Number
3971127
Application Date
September 10, 1975
Publication Date
July 27, 1976
Inventor
David Richard Padnes
Matawan
NJ, US
Winfield Joseph Giguere
Lincroft
NJ, US
Agent
A A Tirva
Assignee
Bell Telephone Laboratories Incorporated
NJ, US
IPC
H05K 3/30
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