03940506 is referenced by 44 patents and cites 2 patents.

This invention relates to a method of selectively treating the surface of an article comprising silicon in part and either silica or silicon nitride in part wherein either the silicon or the silicon compound is etched at a greater rate or a fluoropolymer is deposited on the article by placing the article in a plasma containing fluorine, carbon and reducing species and adjusting the concentration of the reducing species to selectively etch the silicon at a greater rate, etch the silicon compound at a greater rate or deposit polymer.

Title
Selective plasma etching and deposition
Application Number
5/466570
Publication Number
3940506
Application Date
May 3, 1974
Publication Date
February 24, 1976
Inventor
Rudolf August Herbert Heinecke
Harlow
EN
Agent
Vincent Ingrassia
Menotti J Lombardi Jr
John T O Halloran
Assignee
ITT
NY, US
IPC
B05D 3/06
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