Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Title
CURED FILM AND METHOD FOR PRODUCING SAME
Application Number
16/63893
Publication Number
20190004423 (A1)
Application Date
January 10, 2017
Publication Date
January 3, 2019
Assignee
TORAY
JP
IPC
C08G 73/22
G03F 7/40
G03F 7/022
G03F 7/023
View Original Source