The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.

Title
LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
Application Number
15/879903
Publication Number
20180148615 (A1)
Application Date
January 25, 2018
Publication Date
May 31, 2018
IPC
C09J 5/00
C09J 123/14
C09J 123/02
C09J 123/20
C09J 153/00
C09J 123/08
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