Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Title
Microfeature workpieces having alloyed conductive structures, and associated methods
Application Number
13/605761
Publication Number
20130004792
Application Date
September 6, 2012
Publication Date
January 3, 2013
Inventor
William M Hiatt
Eagle
ID, US
Rick C Lake
Meridian
ID, US
Warren M Farnworth
Nampa
ID, US
Assignee
Micron Technology
ID, US
IPC
B32B 15/20
B32B 15/01
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